Snapdragon 8 Elite Gen 6 Pro Live Chipset Die Leak Shows A Massive SoC Thanks To The New Heatsink Implementation That’s Meant To Cool The DRAM Effectively

The first design glimpse of Qualcomm’s upcoming flagship SoC, the Snapdragon 8 Elite Gen 6 Pro, revealed that the chipset has a Heat Pass Block similar to Samsung’s Exynos 2600. Now, we get to see this solution live because a real-life chipset die has been pictured, showing a significantly bigger area than the Snapdragon 8 Elite Gen 5, indicatin...

سەرچاوەی فەرمی بە زمانی ئینگلیزی: https://wccftech.com/snapdragon-8-elite-gen-6-pro-die-leak-heatsink-dram-cooling/