Die Shots For Huawei’s Latest Kirin 9050 Pro Chip Show A Much Smaller Footprint, Encompassing A Logic Die On SMIC’s N+3 Process Bonded To An SRAM Die On The N+2 Process

Huawei is relishing some success in reducing the overall footprint of its new chips by using the innovative LogicFolding technique, and the all-new Kirin 9050 Pro SoC is a testament to the eminent viability of this approach, as clearly illustrated by the new die shots of the chip. Huawei's Kirin 9050 Pro features two identical dies bonded togeth...

سەرچاوەی فەرمی بە زمانی ئینگلیزی: https://wccftech.com/die-shots-for-huaweis-latest-kirin-9050-pro-chip-show-a-much-smaller-footprint-encompassing-a-logic-die-on-smics-n3-process-bonded-to-an-sram-die-on-the-n2-process/