Apple Isn’t Skipping M6 Pro, M6 Max Launches, New Report Says Company Will Adopt A Combination Of SoIC-MH & WMCM Technologies To Improve Interconnect Density And More

The M6 Pro and M6 Max were getting skipped in favor of the M7 Pro and M7 Max, but shortly after the M6 and Mac mini refresh announcement, an update claims that Apple is still developing both higher-end SoCs, and they are said to arrive with advanced packaging technologies like SoIC-MH and WMCM (Wafer-Level Multi-Chip Module), bringing a host of ...

سەرچاوەی فەرمی بە زمانی ئینگلیزی: https://wccftech.com/apple-m6-pro-m6-max-soic-mh-wmcm-packaging-report/