The Taiwan Semiconductor Manufacturing Company (TSMC) might double its chip-on-wafer-on-substrate (CoWoS) capacity from 2026 levels in 2028, suggests a report from the Taiwanese media. TSMC's CoWoS is the leading packaging technology for AI GPUs and is used by major firms such as NVIDIA. The details suggest that the capacity expansion comes at a...
ئەم بابەتە بە تەواوی لە سەرچاوەی فەرمی Wccftech وەرگیراوە و وەرگێڕدراوەتە سەر زمانی کوردی سۆرانی بۆ پلاتفۆرمی PC Gaming.
سەرچاوەی فەرمی بە زمانی ئینگلیزی: https://wccftech.com/report-tsmc-to-double-cowos-capacity-by-2028-as-ai-chip-shortage-spills-over-to-rivals/
