Xiaomi’s XRING 03 Goes Official On TSMC’s 3nm N3P Process, Sports 24 Billion Transistors, First Smartphone SoC To Support LPDDR6 RAM, All-Big-Core CPU Design & More

The XRING 03 might not leverage TSMC’s latest and greatest 2nm lithography, but Xiaomi has successfully managed to bring a host of improvements while sticking with the 3nm N3P node, just a small step-up compared to the XRING 01. With 24 billion transistors, an All-Big-Core CPU design, upgraded GPU, and LPDDR6 RAM support, there’s so much to disc...

سەرچاوەی فەرمی بە زمانی ئینگلیزی: https://wccftech.com/xiaomi-xring-03-official-tsmc-3nm-n3p-lpddr6-ram/